|
Minimum Line/Spacing, Internal Layer
|
N/A
|
N/A
|
.004”/.004”
|
.003”/.003”
|
|
Minimum Line/Spacing, External Layer
|
.007”/.008”
|
.007”/.008”
|
.005”/.005”
|
.003”/.003”
|
|
Aspect Ratio (Thickness to Drill)
|
6:1
|
6:1
|
8:1
|
10:1
|
|
Minimum Drilled Hole Size
|
.010”
|
.008”
|
.008”
|
.008”
|
|
Land Size Internal (Diameter Over Drill)
|
N/A
|
N/A
|
.015”
|
.012”
|
|
Land size External (Diameter Over Drill)
|
.012”
|
.012”
|
.012”
|
.010”
|
|
Plane Clearance (Diameter Over Drill)
|
.030”
|
.030”
|
.030”
|
.024”
|
|
Plated Hole Tolerance
|
+/- .003”
|
+/- .003”
|
+/- .003”
|
+/- .002”
|
|
Minimum Dielectric Thickness
|
N/A
|
N/A
|
.0025”
|
.002”
|
|
Minimum Core Thickness
|
N/A
|
N/A
|
.004”
|
.003”
|
|
Minimum PCB Thickness **
|
.017”
|
.018”
|
.020”
|
.020”
|
|
Maximum PCB Thickness
|
.125”
|
.125”
|
.250”
|
.250”
|
|
Thickness Tolerance (%)
|
+/- 10
|
+/- 10
|
+/- 10
|
+/- 5
|
|
Maximum Board Dimensions *
|
16” x 52”*
|
19” x 22”*
|
17” x 23”*
|
17” x 23”*
|
|
Fabrication Tolerances (overall dimension)
|
+/- .010”
|
+/- .010”
|
+/- .010”
|
+/- .005”
|
|
Bow and Twist (Through Hole) %
|
1.5
|
1.5
|
1.5
|
1
|
|
Bow and Twist (SMT) %
|
.75
|
.75
|
.75
|
.75
|
|
Minimum Conductor to Edge
|
.015”
|
.015”
|
.015”
|
.010”
|
|
Layer to Layer Registration Tolerance
|
N/A
|
.004”
|
.004”
|
.003”
|
|
Component Pitch
|
.025”
|
.025”
|
.025”
|
.015”
|
|
Soldermask Clearance
|
.005”
|
.005”
|
.005”
|
.004”
|
|
Soldermask Dams
|
.005”
|
.005”
|
.005”
|
.004”
|
|
Impedance Tolerance (>50 Ohms) %
|
+/- 10
|
+/- 10
|
+/- 10
|
+/- 8
|
|
Maximum Layers
|
1
|
1
|
12
|
16
|
|
Minimum Copper Weight Inners (oz.)
|
N/A
|
N/A
|
|
1/4
|
|
Maximum Copper Weight Int. Ground (oz.)
|
N/A
|
N/A
|
3
|
8
|
|
Maximum Copper Weight Int. Signal (oz.)
|
N/A
|
N/A
|
2
|
6
|
|
Maximum Copper Weight Ext. Ground (oz.)
|
4
|
4
|
2
|
10
|
|
Maximum Copper Weight Ext. Signal (oz.)
|
4
|
4
|
3
|
10
|
