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FR4 PCB

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  2. Capabilities
  3. FR4 PCB
General Capabilities

  • Single Sided
  • Double Sided
  • Multi Layer
  • Burried Via
  • Blind Via
  • Impedance Controlled
  • Micro Via
  • Laser Drilling
  • RoHS Compliance
  • Epoxy filled vias
Specific Capabilities

Attribute: see (*) below as applies

S/Sided

D/Sided

Multilayer

Advanced

Minimum Line/Spacing, Internal Layer

N/A

N/A

.004”/.004”

.003”/.003”

Minimum Line/Spacing, External Layer

.007”/.008”

.007”/.008”

.005”/.005”

.003”/.003”

Aspect Ratio (Thickness to Drill)

6:1

6:1

8:1

10:1

Minimum Drilled Hole Size

.010”

.008”

.008”

.008”

Land Size Internal (Diameter Over Drill)

N/A

N/A

.015”

.012”

Land size External (Diameter Over Drill)

.012”

.012”

.012”

.010”

Plane Clearance (Diameter Over Drill)

.030”

.030”

.030”

.024”

Plated Hole Tolerance

+/- .003”

+/- .003”

+/- .003”

+/- .002”

Minimum Dielectric Thickness

N/A

N/A

.0025”

.002”

Minimum Core Thickness

N/A

N/A

.004”

.003”

Minimum PCB Thickness **

.017”

.018”

.020”

.020”

Maximum PCB Thickness

.125”

.125”

.250”

.250”

Thickness Tolerance (%)

+/- 10

+/- 10

+/- 10

+/- 5

Maximum Board Dimensions *

16” x 52”*

19” x 22”*

17” x 23”*

17” x 23”*

Fabrication Tolerances (overall dimension)

+/- .010”

+/- .010”

+/- .010”

+/- .005”

Bow and Twist (Through Hole) %

1.5

1.5

1.5

1

Bow and Twist (SMT) %

.75

.75

.75

.75

Minimum Conductor to Edge

.015”

.015”

.015”

.010”

Layer to Layer Registration Tolerance

N/A

.004”

.004”

.003”

Component Pitch

.025”

.025”

.025”

.015”

Soldermask Clearance

.005”

.005”

.005”

.004”

Soldermask Dams

.005”

.005”

.005”

.004”

Impedance Tolerance (>50 Ohms) %

+/- 10

+/- 10

+/- 10

+/- 8

Maximum Layers

1

1

12

16

Minimum Copper Weight Inners (oz.)

N/A

N/A

 

1/4

Maximum Copper Weight Int. Ground (oz.)

N/A

N/A

3

8

Maximum Copper Weight Int. Signal (oz.)

N/A

N/A

2

6

Maximum Copper Weight Ext. Ground (oz.)

4

4

2

10

Maximum Copper Weight Ext. Signal (oz.)

4

4

3

10

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