In the process of SMT patching, some common faults will inevitably occur, resulting in poor PCBA. So, what are the common faults and solutions for SMT chip processing? 1. Component displacement: After the patch glue is cured, the components are displaced. In severe cases, the component pins are not on the pads. The Reasons: The…
Wave soldering is a batch soldering process used to manufacture PCBs. The basic equipment used in the process is the conveyor that moves the PCB through the different areas, the solder pan used during the soldering process, the pump that creates the actual waves, the sprayer for the flux and the preheat pad. Solder is…
PCB printed circuit board making has a very complex process, so what problems should be paid attention to in circuit board manufacturing? 1. First of all, pay attention to have a reasonable direction. In flexible printed circuit processing, various input/output, AC/DC, strong/weak signals, high frequency/low frequency, high voltage/low voltage, etc., their trends should be linear…
In today’s electronic product industry, metal core pcb is the most indispensable key component of the entire electronic product. Since there are many fields involved in PCB manufacturing, if you have not participated in the cheap pcb production process during the blank pcb board design operation, it will directly lead to more focus on performance…
PCB dry film is a polymer compound, which produces a polymerization reaction after ultraviolet irradiation, forming a stable substance attached to the board surface, thereby achieving the function of blocking electroplating and etching. What are the types of fr4 circuit board dry film? 1. Single-sided PCB Board The substrate material is mainly paper phenol (phenol)…
In the production process of PCB circuit boards, some process defects are often encountered, such as poor copper wire fall off of PCB circuit boards (also known as copper rejection), which affects product quality. The common reasons for copper rejection of PCB circuit boards are as follows: PCB Circuit Board Process Factors: 1. The copper…
What problems should be paid attention to when choosing lead-free components for lead-free process? 1. The heat resistance of the components must be considered Due to the high melting point of lead-free solder, one of the characteristics of the smt lead-free soldering process is the high soldering temperature, which brings about the problem of heat…
PCB open circuit is a problem that PCB manufacturers encounter every day. What is PCB open circuit? In simple terms, a PCB open circuit is two points that should be connected together (point A and point B), but are not connected together. What is PCB Open Circuit 1. Repeated open circuit It means that the…
There are many factors that affect the size of the bare pcb board pad. When designing the size of the pad, the range and tolerance of the component size, the need for the size of the solder joint, the accuracy, stability and process capability of the substrate (such as positioning and placement accuracy, etc.) should…
Hot air leveling is to immerse the printed circuit board in molten solder, and then use hot air to blow off the excess solder on the surface and metallized holes to obtain a smooth, uniform and bright solder coating, which has good solderability. The coating is completely free from exposed copper. The exposed copper on…
