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FR4 PCB

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FR4 PCB Technical Manufacturing Capability:

 1, Min. line width/space: 4mil/4mil (0.1mm/0.1mm)

2, Min. hole size: 10mil (0.25mm)

3, Aspect ratio: 8:1

4, Max layer: 16 layers

5, Max. Board size: 1500mm8560mm (59in*22in)

6, Finished board thickness: 0.2~6.0mm

7, Copper foil thickness: 35um~240um (1OZ~7OZ)

8, Remain thickness tolerance after V-CUT:+/-0.1mm

9, Hole position tolerance:+/-0.076mm

10, Profile tolerance: routing outline tolerance:+/-0.13mm; punching outline tolerance:+/-0.05mm

11, Surface finished: Lead free HASL, immersion gold (ENIG), hard gold, gold fingers, immersion silver, immersion Tin, OSP etc.

12, Production capability: 40,000 s.q.m/month

  • MC PCB – FN15

    MC PCB – FN15

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.2mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Single Layer Aluminum Board – FN14

    Single Layer Aluminum Board – FN14

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 3.0mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • 2 Layers Aluminum Base Board – FN13

    2 Layers Aluminum Base Board – FN13

    Product Specification:   Base Material: Aluminum Core laminate Layer: Double layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 3.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Aluminum PCB – FN12

    Aluminum PCB – FN12

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 2.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Metal Core PCB – FN11

    Metal Core PCB – FN11

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Aluminum Core PCB – FN10

    Aluminum Core PCB – FN10

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 2.4mm Thermal conductivity for insulated layer: 3.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Copper Base PCB – FN09

    Copper Base PCB – FN09

    Product Specification:   Material: copper core laminate, Board Thickness: 2.0mm Copper foil: 1oz Solder mask/resist: photoimageable and colored white Legend color: black Surface finish: OSP Thermal conductivity for insulated layer: 3.0W/m-K Break down voltage for insulated layer: 4kV UL&RoHS approval

    Details
  • Single Sided MCPCB – FN08

    Single Sided MCPCB – FN08

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Aluminum PCB – FN07

    Aluminum PCB – FN07

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • Single Layer MCPCB – FN06

    Single Layer MCPCB – FN06

    Product Specification:   Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HASL lead free Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV UL&RoHS approval

    Details
  • 4Layer FR4 PCBs ENIG Blind Hole-FD11

    4Layer FR4 PCBs ENIG Blind Hole-FD11

    4Layer-FR4 PCBs-ENIG- Blind Hole Base Material: fr4 laminate Layer: 4ayer Surface finished: ENIG Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Break down voltage for insulated layer: >2kV

    Details
  • FR-4 PCBs-FD10

    FR-4 PCBs-FD10

    FR-4 PCBs-FD10 Base Material: fr4 laminate Layer: 4 layer Surface finished: ENIG Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Break down voltage for insulated layer: >2kV

    Details
  • MC PCBs Single Layer-FD9

    MC PCBs Single Layer-FD9

    mc pcbs-single layer-FD9 Base Material: Aluminum Core laminate Layer: Single layer Surface finished: HAL Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 2.0W/m-K Break down voltage for insulated layer: >2kV

    Details
  • MC PCBs-Single Layer-FD8

    MC PCBs-Single Layer-FD8

    mc pcbs-single layer-FD8 Base Material: Aluminum Core laminate Layer: Single layer Surface finished: Immersion Gold Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.2mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV

    Details
  • FR-4 PCBs-FD7

    FR-4 PCBs-FD7

    FR-4 PCBs-FD7 Base Material: FR-4laminate Layer: Four layer Surface finished: HASL Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV

    Details
  • FR-4 PCBs-FD6

    FR-4 PCBs-FD6

    FR-4 PCBs-FD6 Base Material: FR-4laminate Layer: Double layer Surface finished: HASL Profile: CNC+V-cut Copper thickness: 1OZ Board thickness: 1.6mm Thermal conductivity for insulated layer: 1.0W/m-K Break down voltage for insulated layer: >2kV

    Details
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  • Guangzhou Ligthing Fair_副本
    21st Guangzhou International Lighting Exhibition
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    Invitation to Warsaw Poland Lighting Fair
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