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1. IQC
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Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products
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2. IPQC
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In-process quality control, Every process on line sampling inspection
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3. Chemical analysis
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Chemical analysis to control on line chemical solution within control range
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4. Physical Laboratory
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To do reliability test and outgoing inspection items
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5. Micro-section
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To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness
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6. Black Light inspection
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To analysis the PTH hole copper coverage before Panel copper plating
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7. Lamination thickness measurement
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To control the product thickness quality even distribution and thickness tolerance under
control
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8. L/S measurement control by 3D
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To control the products after Pattern plating within the design spec. ( Line width and Space width)
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9. CMI measure copper thickness
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CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section
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10. Impedance measurement
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For measuring Impedance control products ( Single strip, Differential …)
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11. Peel strength test
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Testing Solder Mask adhesive
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12. X-ray monitor multi layer drilling
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It control inner and outer layer registration
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13. Hole AOI
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To check hole location compare with Gerber design location accurace
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14. XRF measure Nickel & Gold thickness
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To measuring surface finishing metal thickness
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15. Hi-Pot test
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To checking dielectric insulation capability
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16. 100% O/S test
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To checking circuit normal function as design circuit
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17. Hole counter
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To check missing hole, hole size out spec., no excess holes
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