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What are the Reasons for the Exposure of Copper in the Hot Air Leveling Process of PCB?

Posted on January 7, 2022Industry News
What-are-the-Reasons-for-the-Exposure-of-Copper-in-the-Hot-Air-Leveling-Process-of-PCB-1

Hot air leveling is to immerse the printed circuit board in molten solder, and then use hot air to blow off the excess solder on the surface and metallized holes to obtain a smooth, uniform and bright solder coating, which has good solderability. The coating is completely free from exposed copper. The exposed copper on…

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